Heat shrink technology advancements

Heat shrink technology advancements

Junkosha’s introduces its newest solution for interventional therapies and catheter and guidewire miniaturization.

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Devices/Implants/Equipment Materials

 

Junkosha has launched its Thin Wall FEP, enabling the efficient delivery of guidewires when used for interventional therapies. Junkosha’s Thin Wall FEP HST technology is asolution for interventional therapies using guidewires where leveraging the low coefficient of friction of the FEP surface is a necessity. With a shrink ratio of 1.25:1, and recovered wall thickness down to 0.0025”, Junkosha’s Thin Wall FEP HST provides guide wire manufacturers with a thin, rugged, consistent solution that delivers a compelling alternative to coatings or other surface treatments. The thin recovered wall ensures that the characteristics of the underlying material is not compromised.

Joe Rowan, president and CEO of USA and Europe for Junkosha, says: “We have a deep heritage in materials science and fluoropolymers, which means our solutions are at the leading edge of what is possible. With our Thin Wall FEP HST product, we have created a heat shrink tubing solution that meets the exacting needs of manufacturers when designing guide wires which require lubricious, durable surfaces.

“Our overarching aim is to answer customers’ unmet needs through technology innovation. As a part of this, we are being asked for solutions that take small and thin to the next level. As medical professionals push the boundaries of what they require for interventional techniques, we have taken the lead in designing solutions leveraging our core materials technology that are not readily replicated by our competitors.”

The medical technology sector is advancing at a rapid rate, which is challenging device engineers to produce longer guide wires with low friction surfaces for clinicians to snake through the vascularate to reach previously inaccessible target areas. In the future, it is anticipated that the use of these types of miniaturized, thinner guide wire solutions will become increasingly adopted as manufacturers are asked for solutions that can redefine what is possible through this technique.

 

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