256-Ball BGA adapter converts devices from .8mm pitch to 1.0mm pitch

Aries electronics has introduced a new Correct-A-Chip Ball Grid Array (BGA) adapter that allows .8mm devices to be mounted to PCBs laid out for 1.0mm pitch devices, eliminating the need for new or reworked PCBs. The bottom of the new adapter mounts on a PCB with a BGA pad footprint of 1.0mm pitch, while the top of the adapter accepts BGA devices with .8mm pitch. The new 16x16 array BGA adapter measures .650 in. square and is constructed of 0.040 FR-4 material with .020 in. diameter solder balls of tin/ lead 63/37. PCB plating is ENIG 3- 8µ in. gold per IPC-4552 over 100-µ in. minimum nickel, per ASTM B- 733. The adapter's solder mask is black liquid photo imagable (LPI), and operating temperature is 221°F. Aries can furnish the new adapter using special materials, platings, sizes, and configurations to meet specific customer needs. Aries Electronics, Inc. Frenchtown, NJ arieselec.com