Control Micro Systems expands laser applications lab

Diverse laser technologies addresses a broad range of present and emerging manufacturing challenges.


Orlando, Florida – Control Micro Systems Inc. recently expanded the capabilities of its laser applications lab to include shorter pulse widths, higher peak power, more wavelengths, and more diversified lasers.

The applications lab develops laser solutions for a wide variety of marking, welding, cutting, drilling, and material ablation applications. Successful laser processes include pharmaceutical tablet processing, thin-film conformal coating removal, semiconductor wafer processing, and plastics welding, including breakthrough clear-on-clear welding without the use of additives.

The lab has extensive expertise in plastics marking, UID compliance, and medical device marking for traceability.

The recent addition of a new femtosecond laser station develops emerging short pulse width material processing applications such as glass cutting and micromachining. Control Micro Systems has also expanded the lab capabilities to include CO2 laser power up to 500W, Ytterbium fiber laser up to 3kW peak power and a diverse range of pulsed solid-state lasers. A broad range of materials can be addressed with laser wavelengths ranging from the far-infrared (10,640nm) through 2 micron and the visible spectrum to the UV wavelengths (355nm & 266nm).

Lab services are available at no charge to qualified prospective users of the companies’ laser material processing systems.

Source: Control Micro Systems Inc.