Zarlink Semiconductor will be discussed innovative packaging technologies developed to help shrink the size of electronic components used in implanted and on-body medical devices during the 2011 Medical Electronics Symposium, whcih was held at Arizona State University, Tempe Campus this month.
The presentation, "Disappearing Die - The TIPS project", was led by Martin McHugh, business development manager with Zarlink's Advanced Packaging group. The presentation discussed Zarlink's involvement in the TIPS (Thin Interconnect Package Stack) Project and the successful creation of new processes to integrate complex electronics, such as processors, memories and radios, into ultra-thin stacked packages with a maximum layer thickness of 0.10 millimeters (mm).
"Miniaturization, wireless communication and ultra low-power consumption are key factors for device manufacturers designing smaller and lighter implanted and on-body products supporting advanced therapies," says Steve Swift, Vice President and General Manager of Zarlink's Medical Products Group. "Highly integrated packaging technologies developed through the TIPS Project distinguish Zarlink as we work with medical equipment manufacturers to simplify design of new products and therapies aimed at improving patient comfort and care."
About Zarlink Semiconductor
Zarlink Semiconductor delivers world-leading, mixed-signal chip technologies for a broad range of communication and medical applications. The Company's core capabilities include timing solutions that manage time-sensitive communication applications over wireless and wired networks, line circuits supporting high-quality voice services over cable and broadband connections, and ultra low-power radios enabling new wireless medical devices and therapies. Serving the world's largest original equipment manufacturers, Zarlink's highly integrated chip solutions help customers simplify design, lower costs and reach market quickly. For more information, visit www.zarlink.com .